PCB General Specs

PCB Spec	Instant Quote	Email Quote
Minimum Lead Time	3 Days	3 Days
Layers	2,4	44+
Board Area	10 in. X 10 in.	Up to 18 in. X 18 in.
Board Thickness	1.6 mm	0.4 mm - 12.7 mm
Surface Finish	ENIG	ENEPIG, OSP, Copper, Aluminum, and Many More Upon Request!
Copper Weight	Outer: 1 Oz per Sq.Ft. Inner: ½ Oz per Sq. Ft.	>2 Oz Available
Drill/Hole Size	8 mil (0.2 mm)	8 mil (0.2 mm mech) 3mil (0.0762mm HDI mech)
Micro Via	6 mil (0.15 mm) Drilled Hole, 10 mil (0.25 mm) Full Via Dia, 8 mil (0.2 mm) Preferred min via hole	6 mil (0.15 mm) laser/HDI mechanical, 2 mil (0.05 mm) HDI Laser
Minimum Package Size	0201(0603 metric)	01005 (0402 metric)
Minimum Pad Pitch	20 mil (0.5mm)	16 mil (0.4mm)
Min Trace Width	5 mil (0.13 mm)	3 mil (0.08 mm)
Min Space between Traces	5 mil (0.13 mm)	3 mil (0.08 mm)
Substrate	FR-4 TG150	FR-4 TG135-170, Others Available Upon Request
Solder	SAC305 Lead Free Solder Paste	Other Formulas Available Upon Request
Reflow Max Temp	260*C
Controlled Impedance	Unsupported	Supported
2-Sided Population	Supported	Supported
Visual Inspection	Yes	Yes
AOI	No	Yes
SPI	No	Yes
X-Ray	Yes	Yes

Component Placement

PCB Spec	Instant Quote	Email Quote
Minimum Package Size	0201(0603 metric)	01005 (0402 metric)
Minimum Pad Pitch	20 mil (0.5 mm)	16 mil (0.4 mm)
Distance between Components	5 mil (0.13 mm) ~ 10mil (0.25 mm)

Drill/Hole Size

PCB Spec	Instant Quote	Email Quote
Drill/Hole/Via Size	8 mil (0.2 mm)	3 mil (0.08 mm)
Min Thru Hole Pad Size	40 mil (1.0 mm)
Castellated Holes	Unsupported	24 mil (0.6 mm) Dia.
Hole Tolerance (Plated)	+ 5 mil( 0.13 mm) / - 3 mil (0.08 mm)
Hole Tolerance (Unplated)	8 mil (0.2 mm)

Minimum Annular Ring (Vias / Plated Through Holes)

PCB Spec	Instant Quote	Email Quote
Min Annular Ring	13 mil (0.33 mm)	3 mil(0.1mm)
Min Copper Around Plated Thru Hole	12 mil (0.3mm)	3 mil (0.1mm)

Minimum Clearance

PCB Spec	Instant Quote	Email Quote
Hole to Hole Clearance	20 mil (0.5 mm)	10mil (0.25 mm)
Via to Via Clearance	10 mil (0.25 mm)
Pad to Pad Clearance	5 mil (0.13 mm)	3mil (0.08 mm)
Via-Trace	10 mil (0.25 mm)
Plated Thru Hole-Trace	13 mil (0.33 mm)
Non Plated Thru Hole-Trace	10 mil (0.25 mm)
Pad-Trace	8 mil (0.2 mm)

Min Trace Width / Spacing Width

PCB Spec	Instant Quote	Email Quote
Min Trace Width	5 mil (0.13 mm)	3 mil (0.08 mm)
Min Space between Traces	5 mil (0.13 mm)	3 mil (0.08 mm)

BGA Support / Special Vias Support

PCB Spec	Instant Quote	Email Quote
BGA Pad Size	Unsupported	0.2 mm
BGA Pitch	Unsupported	0.4 mm
Blind/Buried Vias	Unsupported	Blind/Buried

Solder Mask

PCB Spec	Instant Quote	Email Quote
Soldermask Min Spacing	5 mil (0.13 mm)	4 mil (0. 1mm)
Via Covering	Untented unless otherwise specified
Via Filling & Covering	Not Filled	Epoxy: 6 mil - 19 mil, Copper Paste: 8 mil - 19 mil, Copper: 3.5 mil - 6.5 mil

Silkscreen

PCB Spec	Instant Quote	Email Quote
Min Line Width	3mil (0.08 mm)	3 mil (0.08 mm)
Pad-Silkscreen distance	3mil (0.08 mm)

Board Outlines

PCB Spec	Instant Quote	Email Quote
Outline Milling Precision	+/- 8 mil (0.2 mm)	+/- 4 mil (0.1mm)
Trace/Copper to Edge Distance	40 mil (1 mm)	10 mil (0.25mm)
Smallest Cut	12 mil (0.3 mm)	8 mil (0.2 mm)

Trimming

When you upload your board to our website we will ("trim") the following layers if they exceed our manufacturing capabilities. Please be mindful of these changes and how they will affect your PCBA. These changes are reflected in the design rule checks and previews.

Layer	Trimmed According To
Copper Layers	Board Dimensions
Drill Layers	Board Dimensions
Soldermask	Board Dimensions
Solder Paste	Board Dimensions, Drills
Silkscreen	Board Dimensions, Drills, Soldermask