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Our Capabilities
Lead Times
We offer 3 base options for manufacturing lead times:
3 days
ships
Wed, Feb 25
At capacity
5 days
ships
Fri, Feb 27
10 days
ships
Wed, Mar 11
Orders must be placed before 3pm Eastern time (local time in Philadelphia, PA) in order for the lead time to start that day.
Office Closures
The FlashPCB office is scheduled to be closed on the following days:
- Feb 16, 2026 (Presidents' Day)
- Feb 20, 2026 (Maintenance)
- Feb 23, 2026 (Maintenance)
- Feb 24, 2026 (Maintenance)
- Mar 5, 2026 (Maintenance)
- Mar 6, 2026 (Maintenance)
- Mar 9, 2026 (Maintenance)
- May 25, 2026 (Memorial Day)
- Jun 19, 2026 (Juneteenth)
- Jul 3, 2026 (Independence Day)
- Sep 7, 2026 (Labor Day)
- Oct 12, 2026 (Columbus Day (Indigenous Peoples' Day))
- Nov 26, 2026 (Thanksgiving)
- Nov 27, 2026 (Day After Thanksgiving)
- Dec 25, 2026 (Christmas Day)
What Impacts Lead Time
- Cleaning (required for boards with through hole components) adds 1 day
- Every 70 unique parts on a board adds 1 day
Quote Options
We provide two ways to get your board assembled:
Instant Quote
Upload your board and get a quote in minutes
Email Quote
Email us at quote@flashpcb.com to get access to our expanded range of capabilities
PCB General Specs
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Minimum Lead Time | 3 Days | 3 Days |
| Layers | 2,4 | 44+ |
| Board Area | 10 in. X 10 in. | Up to 18 in. X 18 in. |
| Board Thickness | 1.6 mm | 0.4 mm - 12.7 mm |
| Surface Finish | Lead-Free HASL (3 days lead time), ENIG (5 days and up) | ENEPIG, OSP, Copper, Aluminum, and Many More Upon Request! |
| Copper Weight | Outer: 1 Oz per Sq.Ft. Inner: ½ Oz per Sq. Ft. | >2 Oz Available |
| Drill/Hole Size | 8 mil (0.2 mm) | 8 mil (0.2 mm mech) 3mil (0.0762mm HDI mech) |
| Micro Via | 6 mil (0.15 mm) Drilled Hole, 10 mil (0.25 mm) Full Via Dia, 8 mil (0.2 mm) Preferred min via hole | 6 mil (0.15 mm) laser/HDI mechanical, 2 mil (0.05 mm) HDI Laser |
| Minimum Package Size | 0201(0603 metric) | 01005 (0402 metric) |
| Minimum Pad Pitch | 20 mil (0.5mm) | 16 mil (0.4mm) |
| Min Trace Width | 5 mil (0.13 mm) | 3 mil (0.08 mm) |
| Min Space between Traces | 5 mil (0.13 mm) | 3 mil (0.08 mm) |
| Substrate | FR-4 TG150 | FR-4 TG135-170, Others Available Upon Request |
| Solder | SAC305 Lead Free Solder Paste | Other Formulas Available Upon Request |
| Reflow Max Temp | 260*C | |
| Controlled Impedance | Unsupported | Supported |
| 2-Sided Population | Supported | Supported |
| Visual Inspection | Yes | Yes |
| AOI | No | Yes |
| SPI | No | Yes |
| X-Ray | Yes | Yes |
Component Placement
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Minimum Package Size | 0201(0603 metric) | 01005 (0402 metric) |
| Minimum Pad Pitch | 20 mil (0.5 mm) | 16 mil (0.4 mm) |
| Distance between Components | 5 mil (0.13 mm) ~ 10mil (0.25 mm) |
Drill/Hole Size
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Drill/Hole/Via Size | 8 mil (0.2 mm) | 3 mil (0.08 mm) |
| Min Thru Hole Pad Size | 40 mil (1.0 mm) | |
| Castellated Holes | Unsupported | 24 mil (0.6 mm) Dia. |
| Hole Tolerance (Plated) | + 5 mil( 0.13 mm) / - 3 mil (0.08 mm) | |
| Hole Tolerance (Unplated) | 8 mil (0.2 mm) |
Minimum Annular Ring (Vias / Plated Through Holes)
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Min Annular Ring | 13 mil (0.33 mm) | 3 mil(0.1mm) |
| Min Copper Around Plated Thru Hole | 12 mil (0.3mm) | 3 mil (0.1mm) |
Minimum Clearance
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Hole to Hole Clearance | 20 mil (0.5 mm) | 10mil (0.25 mm) |
| Via to Via Clearance | 10 mil (0.25 mm) | |
| Pad to Pad Clearance | 5 mil (0.13 mm) | 3mil (0.08 mm) |
| Via-Trace | 10 mil (0.25 mm) | |
| Plated Thru Hole-Trace | 13 mil (0.33 mm) | |
| Non Plated Thru Hole-Trace | 10 mil (0.25 mm) | |
| Pad-Trace | 8 mil (0.2 mm) |
Min Trace Width / Spacing Width
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Min Trace Width | 5 mil (0.13 mm) | 3 mil (0.08 mm) |
| Min Space between Traces | 5 mil (0.13 mm) | 3 mil (0.08 mm) |
BGA Support / Special Vias Support
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| BGA Pad Size | Unsupported | 0.2 mm |
| BGA Pitch | Unsupported | 0.4 mm |
| Blind/Buried Vias | Unsupported | Blind/Buried |
Solder Mask
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Soldermask Min Spacing | 5 mil (0.13 mm) | 4 mil (0. 1mm) |
| Via Covering | Untented unless otherwise specified | |
| Via Filling & Covering | Not Filled | Epoxy: 6 mil - 19 mil, Copper Paste: 8 mil - 19 mil, Copper: 3.5 mil - 6.5 mil |
Silkscreen
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Min Line Width | 3mil (0.08 mm) | 3 mil (0.08 mm) |
| Pad-Silkscreen distance | 3mil (0.08 mm) |
Board Outlines
| PCB Spec | Instant Quote | Email Quote |
|---|---|---|
| Outline Milling Precision | +/- 8 mil (0.2 mm) | +/- 4 mil (0.1mm) |
| Trace/Copper to Edge Distance | 40 mil (1 mm) | 10 mil (0.25mm) |
| Smallest Cut | 12 mil (0.3 mm) | 8 mil (0.2 mm) |
Trimming
When you upload your board to our website we will ("trim") the following layers if they exceed our manufacturing capabilities. Please be mindful of these changes and how they will affect your PCBA. These changes are reflected in the design rule checks and previews.
| Layer | Trimmed According To |
|---|---|
| Copper Layers | Board Dimensions |
| Drill Layers | Board Dimensions |
| Soldermask | Board Dimensions |
| Solder Paste | Board Dimensions, Drills |
| Silkscreen | Board Dimensions, Drills, Soldermask |