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Our Capabilities
We provide two ways to get your board assembled:
Instant Quote
Upload your board and get a quote in minutes
Email Quote
Email us at quote@flashpcb.com to get access to our expanded range of capabilities

PCB General Specs

PCB SpecInstant QuoteEmail Quote
Minimum Lead Time3 Days3 Days
Board Area10 in. X 10 in.Up to 18 in. X 18 in.
Board Thickness1.6 mm0.4 mm - 12.7 mm
Surface FinishLead-Free HASL (3 days lead time), ENIG (5 days and up)ENEPIG, OSP, Copper, Aluminum, and Many More Upon Request!
Copper WeightOuter: 1 Oz per Sq.Ft. Inner: ½ Oz per Sq. Ft.>2 Oz Available
Drill/Hole Size8 mil (0.2 mm)8 mil (0.2 mm mech) 3mil (0.0762mm HDI mech)
Micro Via6 mil (0.15 mm) Drilled Hole, 10 mil (0.25 mm) Full Via Dia, 8 mil (0.2 mm) Preferred min via hole6 mil (0.15 mm) laser/HDI mechanical, 2 mil (0.05 mm) HDI Laser
Minimum Package Size0201(0603 metric)01005 (0402 metric)
Minimum Pad Pitch20 mil (0.5mm)16 mil (0.4mm)
Min Trace Width5 mil (0.13 mm)3 mil (0.08 mm)
Min Space between Traces5 mil (0.13 mm)3 mil (0.08 mm)
SubstrateFR-4 TG150FR-4 TG135-170, Others Available Upon Request
SolderSAC305 Lead Free Solder PasteOther Formulas Available Upon Request
Reflow Max Temp260*C
Controlled ImpedanceUnsupportedSupported
2-Sided PopulationSupportedSupported
Visual InspectionYesYes

Component Placement

PCB SpecInstant QuoteEmail Quote
Minimum Package Size0201(0603 metric)01005 (0402 metric)
Minimum Pad Pitch20 mil (0.5 mm)16 mil (0.4 mm)
Distance between Components5 mil (0.13 mm) ~ 10mil (0.25 mm)

Drill/Hole Size

PCB SpecInstant QuoteEmail Quote
Drill/Hole/Via Size8 mil (0.2 mm)3 mil (0.08 mm)
Min Thru Hole Pad Size40 mil (1.0 mm)
Castellated HolesUnsupported24 mil (0.6 mm) Dia.
Hole Tolerance (Plated)+ 5 mil( 0.13 mm) / - 3 mil (0.08 mm)
Hole Tolerance (Unplated)8 mil (0.2 mm)

Minimum Annular Ring (Vias / Plated Through Holes)

PCB SpecInstant QuoteEmail Quote
Min Annular Ring13 mil (0.33 mm)3 mil(0.1mm)
Min Copper Around Plated Thru Hole12 mil (0.3mm)3 mil (0.1mm)

Minimum Clearance

PCB SpecInstant QuoteEmail Quote
Hole to Hole Clearance20 mil (0.5 mm)10mil (0.25 mm)
Via to Via Clearance10 mil (0.25 mm)
Pad to Pad Clearance5 mil (0.13 mm)3mil (0.08 mm)
Via-Trace10 mil (0.25 mm)
Plated Thru Hole-Trace13 mil (0.33 mm)
Non Plated Thru Hole-Trace10 mil (0.25 mm)
Pad-Trace8 mil (0.2 mm)

Min Trace Width / Spacing Width

PCB SpecInstant QuoteEmail Quote
Min Trace Width5 mil (0.13 mm)3 mil (0.08 mm)
Min Space between Traces5 mil (0.13 mm)3 mil (0.08 mm)

BGA Support / Special Vias Support

PCB SpecInstant QuoteEmail Quote
BGA Pad SizeUnsupported0.2 mm
BGA PitchUnsupported0.4 mm
Blind/Buried ViasUnsupportedBlind/Buried

Solder Mask

PCB SpecInstant QuoteEmail Quote
Soldermask Min Spacing5 mil (0.13 mm)4 mil (0. 1mm)
Via CoveringUntented unless otherwise specified
Via Filling & CoveringNot FilledEpoxy: 6 mil - 19 mil, Copper Paste: 8 mil - 19 mil, Copper: 3.5 mil - 6.5 mil


PCB SpecInstant QuoteEmail Quote
Min Line Width3mil (0.08 mm)3 mil (0.08 mm)
Pad-Silkscreen distance3mil (0.08 mm)

Board Outlines

PCB SpecInstant QuoteEmail Quote
Outline Milling Precision+/- 8 mil (0.2 mm)+/- 4 mil (0.1mm)
Trace/Copper to Edge Distance40 mil (1 mm)10 mil (0.25mm)
Smallest Cut12 mil (0.3 mm)8 mil (0.2 mm)


When you upload your board to our website we will ("trim") the following layers if they exceed our manufacturing capabilities. Please be mindful of these changes and how they will affect your PCBA. These changes are reflected in the design rule checks and previews.

LayerTrimmed According To
Copper LayersBoard Dimensions
Drill LayersBoard Dimensions
SoldermaskBoard Dimensions
Solder PasteBoard Dimensions, Drills
SilkscreenBoard Dimensions, Drills, Soldermask